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saIe@csun_com_tW 冒  回 _齷 P  尤‵裝製禾王言又備 靦 O comp|y with SEM| Sz cer廿ficati。n  \\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\} - High c|ass|eve|for c|ean-room  差 】 ‵ O Fasttherma|contro|capabi|ity  l差〕 【 鼻: \\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\] O EXce||enttherma|uniformi亡y  ` .ˉ "'ˉˉ' ′囊_薰壼 一′ 一 _差曩` _ SEcS/GEM ! 差 ′  i 『 屢帷啃' vr'一育O Maintenance door(rear】 ˉ 「卞ˉ ˉ 選 I宁 圭` i _ _ ˉ】 ′^ `_‵ ˉ       一一一貫干 阜j 育 育一 丁——育 一一插堂一 cl亭`  一一「 `重 —`貴— 一丁貴'—亨一 ‵瞄一 ′ 飆 ˋ二二ˉ:=三ˉ異 ' 貫一 『貫 ′丁二:士育亡 一 一 貫、亡 l 斗i二,〝i一巨 玉`  圖 ll 〝 加叫一〝` 土二二二一二   二 ˉ ′ 一亡 ‵ /‵  言`『盲 . Il 乩 乒 O DeSigned f。r Temporary Bonding procesS ˉ`育 ˉ` ˉ\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\` ' ˉ _ O Max. pressure:0.5 MPa 荂 Max.temperature : 250。C O F|exib|e process capabi|itY : VaCuum Baking/ Carrier B。nding - Rea| time proCeSs StatuS diSp|aY O sECs/GEM Compatible 土 口 鱈' 屢'〞〞ˊ止‵呈 苧寥蕁辜  


































































































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