Page 11 - 2025 TSIA年刊

Wafer Electro-Plating System Model ZP300A 電鍍設備ZP300A型 New electro-plating system have been released with excellent process performance, productivity, and maintain- ability in response to the advanced packaging market, where the level of technological requirements and market size are rapidly increasing. Plating System Model UFP 電鍍設備 UFP型 Model UFP-AS is flat panel electroplating system for multiple plating applications such as bump, RDL, and via filling. Recently this system has adopted in the field of advanced panel level packaging. Bevel Polishing System Model EAC 晶邊研磨設備 EAC型 Model EAC is wafer bevel polishing system with excellent removal performance by fixed abrasive polishing method which enables non-selective material removal at wafer bevel. With its recipe controllable polishing head, it achieves highly precise wafer edge shape control. Dry Vacuum Pump for Medium Duty Applications Model EV-X 中負荷製程適用的乾式真空幫浦 EV-X型 Vacuum pumps are required to be smaller and capable of handling higher duty since the number of component systems installed in Subfab is increasing due to the increasing process duty and complexity. Model EV-X has been released in order to meet the market requirement for smaller and more durable vacuum pump. CMP System Model F-REX300XA CMP設備 F-REX300XA型 New CMP equipment meets the demands for higher productivity and the stricter technical demands for high performance devices. *「○○○型」表示荏原的機型編號 "Model○○○" is our model code. 對應多種範圍的製程需求 Wide process coverage