Page 56 - 2025 TSIA年刊

2025 林懷恩 Huai-En Lin 國立陽明交通大學 材料科學與工程學系 獲獎摘要 林懷恩同學自 2020 年起於國立陽明交通大學材料科學與工程學系攻讀博士班，並於 2025 年 3 月 完成博士學位。其研究致力於先進封裝、三維積體電路封裝、異質接合，以及臨場原子力顯微鏡 等技術，成果豐碩，已發表 5 篇國際期刊論文及 9 篇國際研討會論文。其於 2024 年封裝領域頂尖 會議 ECTC 發表之論文榮獲 Student Travel Award，並曾獲多項獎項肯定。 得獎經歷 / 專利 • 2024 74th Electronic Components and Technology Conference (ECTC) Student Travel Award • 2024 國立陽明交通大學「第 29 屆科林研發論文獎」博士論文優等獎 • 2024 台灣電路板協會 PCB Best Paper Award Silver Price 重要學術著作 • 2024 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Best Student Award • 2024 29th International Electron Devices & Materials Symposium (IEDMS) Outstanding Poster Award • 2022 台積電博士班獎學金 • 2022 國科會優秀博士生獎學金 1. H. E. Lin, D. P. Tran, W. L. Chiu, H. H. Chang, C. Chen, (2024). In-situ measurement of thermal expansion in Cu/SiO2 hybrid structures using atomic force microscopy at elevated temperatures. Applied Surface Science, 662, 160103. 2. H. E. Lin, D. P. Tran, W. L. Chiu, H. H. Chang, C. Chen, (2024). Enhanced thermal expansion with nanocrystalline Cu in SiO2 vias for hybrid bonding. Applied Surface Science, 672, 160784. 3. H. E. Lin, W. L. Chiu, H. H. Chang, Y. T. Yang, C. Chen, (2025). Revealing challenges of downscaling effects on Cu thermal expansion in advanced hybrid bonding using in-situ AFM. Applied Surface Science, 162539. 4. H. E. Lin, D. P. Tran, G. H. Lin, H. J. Chuang, C. Chen, (2024). Effects of residual stress and microstructure on extremely anisotropic grain growth in nanotwinned Cu films. Materials Characterization, 211, 113891. 5. H. E. Lin, W. L. Chiu, H. H. Chang, C. Chen, (2024). Observation of Thermal Expansion Behavior of Nanotwinned-Cu/SiO2 & Regular-Cu/SiO22 Hybrid Structure via In-Situ Heating AFM. 2024 IEEE 74th Electronic Components and Technology Conference (ECTC). IEEE. 6. H. E. Lin, Y. X. Huang, W. L. Chiu, H. H. Chang, C. Chen, (2025). Elimination of Leakage in NaOH-activated Cu/SiO2 Hybrid Bonding for Plasma-Free Surface Activation Schem. 2025 International Conference on Electronics Packaging (ICEP). IEEE. 7. H. E. Lin, W. L. Chiu, H. H. Chang, C. Chen, (2024). Inspection, estimation, and design of hybrid bonding in 3D IC fabrication using insitu heating atomic force microscopy. 2024 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE. 8. H. E. Lin, C. Chen, (2023). Investigation on Thermal Stability of NT-Cu in Fine Pitch Damascene Vias. 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE. 9. H. E. Lin, C. Chen, (2021). Improvement of bonding strength via anisotropic grain growth in Cu-Cu bonds. 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE. 10. H. E. Lin, W. L. Chiu, H. H. Chang, C. Chen, (2025). In-situ AFM Observation of Enhanced Thermal Expansion in Downscaled Nanotwinned- Cu/SiO2 Vias for 3D IC Integration. Journal of Materials Research and Technology, 36, 9091-9099. 指導教授 陳智 講座教授 現職 · 國立陽明交通大學 / 材料科學與工程學系 學歷 · UCLA Materials Science & Engineering Ph.D. 經歷 · 國立交通大學 / 材料系特聘教授兼系主任 (2017.2~2023.1) · 國立交通大學 / 材料系特聘教授兼奈米學士班主任 (2012.8~2017.1) · 國立交通大學 / 材料科學與工程研究所教授 (2007.8~ 迄今 ) 54